Major contractual projects involving SPINTEC
GREAT – A H2020 ICT project at SPINTEC (June 30th, 2016)
Overview GREAT (European H2020 project) was accepted at the Summer 2015. Its kick-off meeting took place at SPINTEC in Grenoble on February 22nd-23rd 2016. The project aims at developing magnetic stacks able to equally perform memory, radio-frequency as well as sensor functionalities on the same chip, to address Internet of Things (IoT) applications. The main objectives of […]
Read moreSPICE – An H2020 FET project at SPINTEC (May 19th, 2016)
A new research project has been accepted at the last FET H2020 call. The objective of SPICE is to realize a novel integration platform that combines photonic, magnetic and electronic components. Its validity will be shown by a conceptually new spintronic-photonic memory chip demonstrator with three orders of magnitude faster write speed and two orders […]
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